6σ Robust Lightweight Design of the GIL/GIS Bus Based on Co‐Simulation of Insulation, Current Flow, and Mechanical Stress
Article in IEEJ Transactions on Electrical and Electronic Engineering (May 2024)
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Article in IEEJ Transactions on Electrical and Electronic Engineering (May 2024)
Conference proceeding in SAE Technical Papers (April 2024)
Book chapter (February 2024)