Method for producing and testing a corrosion-resistant channel in a silicon device Grant US-6869818-B2 United States of America 22 Mar 2005
Method of manufacturing semiconductor device using a hagolen plasma treatment step Grant US-5620925-A United States of America 15 Apr 1997
Method for plasma etching tapered and stepped vias Grant US-5354386-A United States of America 11 Oct 1994
METHOD OF LASER ETCHING OF SILICON DIOXIDE Application WO-1993018545-A1 World Intellectual Property Organisation (WIPO) 16 Sep 1993
Profile tailored trench etch using a SF6 -O2 etching composition wherein both isotropic… Grant US-5182234-A United States of America 26 Jan 1993
PROCESS FOR REMOVING DEPOSITS FROM BACKSIDE AND END EDGE OF SEMICONDUCTOR WAFER WHILE… Grant US-5075256-A United States of America 24 Dec 1991
Process for selective deposition of tungsten on semiconductor wafer Grant US-5043299-A United States of America 27 Aug 1991
Method for fabricating an activatable conducting link for metallic conductive wiring in a… Grant US-4968643-A United States of America 06 Nov 1990
Apparatus and method for reactive ion etching Grant US-4950377-A United States of America 21 Aug 1990
Etching metal films with complexing chloride plasma Grant US-4919750-A United States of America 24 Apr 1990