👇a couple of Dr Gu's papers 👇 In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint https://t.co/D0WdMheV0c Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder https://
"Rainbow" recrystallisation within near single crystal tin-based solder alloys deformed under creep. We observe a host of new grain orientations being generated in these beautiful #EBSD maps - captured by @gth92 of @ExpMicroMech #MyFavEM https://t.co/PhHr
RT @ExpMicroMech: New work looking at creep of lead-free solders, by @gth92 Dr Chris Gourlay and @bmatb which includes some beautiful and i…