Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Overview of attention for article published in Journal of Electronic Materials, September 2010

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So far, Altmetric has seen 5 patents that reference this research output.

Three-dimensional printing

Grant US-11759863-B2

United States of America

THREE-DIMENSIONAL PRINTING

Application US-20210283690-A1

United States of America

Method of manufacturing printed circuit boards

Grant US-10973131-B2

United States of America

Core-shell nanostructures and related inks, films and methods

Grant US-10563080-B2

United States of America

Methods for making copper inks and films

Grant US-10047236-B1

United States of America