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Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO
Overview of attention for article published in Journal of Central South University, October 2008
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About this Attention Score
Among the highest-scoring outputs from this source (#28 of 165)
Mentioned by
patent
2
patents
Citations
dimensions_citation
1
Dimensions
Readers on
mendeley
6
Mendeley
Summary
Patents
Dimensions citations
So far, Altmetric has seen
2
patents that reference this research output.
Package Testing
Application US-20160259865-A1
United States of America
08 Sep 2016
Package Testing
Application US-20160217222-A1
United States of America
28 Jul 2016