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RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly

Overview of attention for article published in Journal of Failure Analysis and Prevention, June 2017
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About this Attention Score

  • In the top 25% of all research outputs scored by Altmetric
  • One of the highest-scoring outputs from this source (#3 of 100)
  • Good Attention Score compared to outputs of the same age (79th percentile)

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