UV and reducing treatment for K recovery and surface clean in semiconductor processing Grant US-10037905-B2 United States of America 31 Jul 2018
Multi-station sequential curing of dielectric films Grant US-9873946-B2 United States of America 23 Jan 2018
Low temperature formation of high quality silicon oxide films in semiconductor device… Grant US-9847221-B1 United States of America 19 Dec 2017
Tensile dielectric films using UV curing Application US-9659769-B1 United States of America 23 May 2017