Title |
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit
|
---|---|
Published in |
Journal of Electronic Materials, April 2011
|
DOI | 10.1007/s11664-011-1613-1 |
Authors |
J. Harris, O. Graudejus, S. Wagner |
Mendeley readers
The data shown below were compiled from readership statistics for 13 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Switzerland | 1 | 8% |
Unknown | 12 | 92% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 6 | 46% |
Researcher | 2 | 15% |
Student > Postgraduate | 2 | 15% |
Student > Master | 1 | 8% |
Professor > Associate Professor | 1 | 8% |
Other | 1 | 8% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 7 | 54% |
Materials Science | 3 | 23% |
Physics and Astronomy | 1 | 8% |
Agricultural and Biological Sciences | 1 | 8% |
Medicine and Dentistry | 1 | 8% |
Other | 0 | 0% |