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Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit

Overview of attention for article published in Journal of Electronic Materials, April 2011
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13 Mendeley
Title
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit
Published in
Journal of Electronic Materials, April 2011
DOI 10.1007/s11664-011-1613-1
Authors

J. Harris, O. Graudejus, S. Wagner

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 13 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Switzerland 1 8%
Unknown 12 92%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 6 46%
Researcher 2 15%
Student > Postgraduate 2 15%
Student > Master 1 8%
Professor > Associate Professor 1 8%
Other 1 8%
Readers by discipline Count As %
Engineering 7 54%
Materials Science 3 23%
Physics and Astronomy 1 8%
Agricultural and Biological Sciences 1 8%
Medicine and Dentistry 1 8%
Other 0 0%