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Ceramic joining II partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers
Overview of attention for article published in Journal of Materials Science, September 2004
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Electrical feedthrough assembly
Grant US-8552311-B2
United States of America
08 Oct 2013
Implantable hermetic feedthrough
Grant US-8386047-B2
United States of America
26 Feb 2013