Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I. Microhardness in relation to coating structure

Overview of attention for article published in Journal of Applied Electrochemistry, November 1985

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Method for low temperature annealing of metallization micro-structures in the production…

Grant US-7462269-B2

United States of America

Method for filling recessed micro-structures with metallization in the production of a…

Grant US-7244677-B2

United States of America

Method of submicron metallization using electrochemical deposition of recesses including…

Grant US-7144805-B2

United States of America

Method and apparatus for low-temperature annealing of metallization microstructures in…

Grant US-7001471-B2

United States of America

Submicron metallization using electrochemical deposition

Grant US-6806186-B2

United States of America

Method for filling recessed micro-structures with metallization in the production of a…

Grant US-6753251-B2

United States of America