Nano finish grinding of brittle materials using electrolytic in-process dressing (ELID) technique

Overview of attention for article published in Sādhanā, October 2003

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Among the highest-scoring outputs from this source (#23 of 144)

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So far, Altmetric has seen 2 patents that reference this research output.

Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder

Grant US-8712575-B2

United States of America

Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side Wafer Grinder

Application US-20110237160-A1

United States of America