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Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Overview of attention for article published in Microsystem Technologies, October 2005
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About this Attention Score

  • In the top 25% of all research outputs scored by Altmetric
  • One of the highest-scoring outputs from this source (#3 of 596)
  • High Attention Score compared to outputs of the same age (94th percentile)
  • High Attention Score compared to outputs of the same age and source (94th percentile)

Mentioned by

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5 patents
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1 Wikipedia page

Citations

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163 Dimensions

Readers on

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125 Mendeley
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1 CiteULike