Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead

Overview of attention for article published in Journal of Electronic Testing, February 2014

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Among the highest-scoring outputs from this source (#22 of 112)
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patent: 4 patents

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mendeley: 101 Mendeley

Summary Patents Dimensions citations

So far, Altmetric has seen 4 patents that reference this research output.

Integrated circuit device die with wafer/package detection circuit

Grant US-11842934-B2

United States of America

Integrated circuit authentication from a die material measurement

Grant US-10942215-B2

United States of America

Integrated circuit authentication from a die material measurement

Application US-10429438-B1

United States of America

Device for prevention of integrated circuit chip counterfeiting

Grant US-9806037-B2

United States of America