Showing items 201–256
Method for fabrication of a semiconductor device and structure
Grant US-9029173-B2
United States of America
Semiconductor device and structure
Grant US-9000557-B2
United States of America
Semiconductor device and structure
Grant US-8994404-B1
United States of America
Method for developing a custom device
Grant US-8987079-B2
United States of America
Semiconductor device and structure for heat removal
Grant US-8975670-B2
United States of America
Method of manufacturing a semiconductor device with two monocrystalline layers
Grant US-8956959-B2
United States of America
Joining process for superalloys
Grant US-8925792-B1
United States of America
Semiconductor device and structure
Grant US-8921970-B1
United States of America
Semiconductor device and structure
Grant US-8912052-B2
United States of America
System comprising a semiconductor device and structure
Grant US-8907442-B2
United States of America
PRECIPITATION HARDENED PARTIAL TRANSIENT LIQUID PHASE BOND
Application WO-2014193506-A1
World Intellectual Property Organisation (WIPO)
Method of maintaining a memory state
Grant US-8902663-B1
United States of America
Semiconductor device and structure for heat removal
Grant US-8901613-B2
United States of America
Chip-to-substrate transient liquid phase bonding using a spacer
Application EP-2800130-A1
European Patent Office
PROCESS FOR CONNECTING JOINING PARTNERS BY MEANS OF AN ISOTHERMIC SOLIDIFYING REACTION IN…
Application WO-2014154637-A1
World Intellectual Property Organisation (WIPO)
Method to construct a 3D semiconductor device
Grant US-8846463-B1
United States of America
Semiconductor device and structure
Grant US-8836073-B1
United States of America
Semiconductor and optoelectronic devices
Grant US-8823122-B2
United States of America
3D semiconductor device and structure
Grant US-8803206-B1
United States of America
Method for fabricating novel semiconductor and optoelectronic devices
Grant US-8753913-B2
United States of America
Monolithic three-dimensional semiconductor device and structure
Grant US-8754533-B2
United States of America
Semiconductor device and structure
Grant US-8742476-B1
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8709880-B2
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8703597-B1
United States of America
Semiconductor device and structure
Grant US-8687399-B2
United States of America
Semiconductor device and structure
Grant US-8686428-B1
United States of America
Semiconductor device and structure
Grant US-8674470-B1
United States of America
Method for design and manufacturing of a 3D semiconductor device
Grant US-8669778-B1
United States of America
Method for fabrication of configurable systems
Grant US-8664042-B2
United States of America
Method of forming three dimensional integrated circuit devices using layer transfer…
Grant US-8642416-B2
United States of America
3D memory semiconductor device and structure
Grant US-8581349-B1
United States of America
Method to form a 3D semiconductor device and structure
Grant US-8574929-B1
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8557632-B1
United States of America
Semiconductor device and structure
Grant US-8541819-B1
United States of America
Method of manufacturing a semiconductor device and structure
Grant US-8536023-B2
United States of America
3D integrated circuit with logic
Grant US-8492886-B2
United States of America
Method of fabricating a semiconductor device and structure
Grant US-8476145-B2
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8461035-B1
United States of America
Semiconductor device and structure for heat removal
Grant US-8450804-B2
United States of America
Semiconductor device and structure
Grant US-8440542-B2
United States of America
3D semiconductor device
Application US-8427200-B2
United States of America
System comprising a semiconductor device and structure
Grant US-8405420-B2
United States of America
Semiconductor device and structure
Grant US-8395191-B2
United States of America
Semiconductor device and structure
Grant US-8384426-B2
United States of America
Method to construct systems
Grant US-8378715-B2
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8378494-B2
United States of America
Semiconductor device and structure
Application US-8379458-B1
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8373230-B1
United States of America
3D semiconductor device
Grant US-8373439-B2
United States of America
3D semiconductor device including field repairable logics
Grant US-8362800-B2
United States of America
Semiconductor device and structure
Grant US-8362482-B2
United States of America
Method for fabrication of a semiconductor device and structure
Grant US-8294159-B2
United States of America
Method of constructing a semiconductor device and structure
Grant US-8273610-B2
United States of America
System comprising a semiconductor device and structure
Grant US-8237228-B2
United States of America
Semiconductor device and structure
Grant US-8203148-B2
United States of America
Showing items 201–256