High density microwave hermetic interconnects for quantum applications Grant US-11900217-B2 United States of America 13 Feb 2024
High density microwave hermetic interconnects for quantum applications Grant US-11551125-B2 United States of America 10 Jan 2023
Printed circuit board to dielectric layer transition with controlled impedance and… Grant US-11102879-B2 United States of America 24 Aug 2021
Monolithic signal carrier device implemented in cryogenic quantum computing applications Grant US-10681842-B1 United States of America 09 Jun 2020